multi-layer fr4 half-hole buried blind hole circuit board processing metalized edging impedance board copy board design pcb proofing_心新百货

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multi-layer fr4 half-hole buried blind hole circuit board processing metalized edging impedance board copy board design pcb proofing

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multi-layer fr4 half-hole buried blind hole circuit board processing metalized edging impedance board copy board design pcb proofing

多层FR4半孔埋盲孔电路板加工金属化包边阻抗板抄板设计pcb打样

EXW Price: Min. order:

¥6.25
≥1/piece

¥3.75
≥1000/piece

¥2.88
≥5000/piece

1 piece

Exchage Rate 1 CNY ≈ 0.1419 USD
Weight 0.5 kg/piece

specifications

Specifications

Specifications		Stock	Quantity
1(1)	¥0.0	93372 piece available

Summary 0 piece Subtotal:¥ 0 Selected ∧

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Update time：20240826111305

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